Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7880296 | Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereon | Lin-Yin Wong | 2011-02-01 |
| 7754598 | Method for manufacturing coreless packaging substrate | Wei-Hung Lin | 2010-07-13 |
| 7507915 | Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same | Chia-Wei Chang, Lin-Yin Wong, Chung-Cheng Lien | 2009-03-24 |
| 7323762 | Semiconductor package substrate with embedded resistors and method for fabricating the same | Lin-Yin Wong | 2008-01-29 |
| 7135377 | Semiconductor package substrate with embedded resistors and method for fabricating same | Lin-Yin Wong | 2006-11-14 |