Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7396753 | Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same | E-Tung Chou, Lin-Yin Wong | 2008-07-08 |
| 6916685 | Method of plating metal layer over isolated pads on semiconductor package substrate | Wei Yang, Kuo-Sheng Wei | 2005-07-12 |