| 7498224 |
Strained silicon forming method with reduction of threading dislocation density |
Pang-Shiu Chen, Sheng-Wei Lee, Chee-Wee Liu |
2009-03-03 |
| 7202512 |
Construction of thin strain-relaxed SiGe layers and method for fabricating the same |
Pang-Shiu Chen, Sheng-Wei Lee, Kao-Feng Liao, Chee-Wee Liu |
2007-04-10 |
| 7102153 |
Strained silicon forming method with reduction of threading dislocation density |
Pang-Shiu Chen, Sheng-Wei Lee, Chee-Wee Liu |
2006-09-05 |
| 6858123 |
Galvanizing solution for the galvanic deposition of copper |
Jung-Chih Hu, Wu-Chun Gau, Ting-Chang Chang, Ming Feng, Chun-Lin Cheng +2 more |
2005-02-22 |
| 6417118 |
Method for improving the moisture absorption of porous low dielectric film |
Jung-Chih Hu |
2002-07-09 |
| 6083829 |
Use of a low resistivity Cu.sub.3 Ge interlayer as an adhesion promoter between copper and tin layers |
Jane-Bai Lai, Chung-Shi Liu, Chen-Hua Yu |
2000-07-04 |
| 6043148 |
Method of fabricating contact plug |
Yuan-Ching Peng, Yu-Ru Yang, Win-Yi Hsieh, Yong-Fen Hsieh |
2000-03-28 |
| 6022457 |
Method of manufacturing cobalt silicide layer |
Hsin-Yuan Huang, Yuan-Ching Peng, Yong-Fen Hsieh |
2000-02-08 |
| 6015749 |
Method to improve adhesion between copper and titanium nitride, for copper interconnect structures, via the use of an ion implantation procedure |
Chung-Shi Liu, Chen-Hua Yu, Jane-Bai Lai |
2000-01-18 |
| 5897373 |
Method of manufacturing semiconductor components having a titanium nitride layer |
Yuan-Ching Peng, Wen-Yi Hsieh, Jenn-Tarng Lin, Yong-Fen Hsieh |
1999-04-27 |
