| 7550315 |
Method for fabricating semiconductor package with multi-layer die contact and external contact |
Victor Tan Cher Khng |
2009-06-23 |
| 7465488 |
Bow control in an electronic package |
Lee Choon Kuan |
2008-12-16 |
| 7253022 |
Method for fabricating semiconductor package with multi-layer metal bumps |
Victor Tan Cher 'Khng |
2007-08-07 |
| 7235872 |
Bow control in an electronic package |
Lee Choon Kuan |
2007-06-26 |
| 7208828 |
Semiconductor package with wire bonded stacked dice and multi-layer metal bumps |
Victor Cher 'Khng |
2007-04-24 |
| 7202556 |
Semiconductor package having substrate with multi-layer metal bumps |
Victor Tan Cher 'Khng |
2007-04-10 |
| 7161236 |
Bow control in an electronic package |
Lee Choon Kuan |
2007-01-09 |
| 6781248 |
Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged |
Chong Chin Hui, Jason Pittam |
2004-08-24 |
| 6638792 |
Method for fabricating BOC semiconductor package |
Chong Chin Hui, Lee Choon Kian |
2003-10-28 |
| 6507114 |
BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die |
Chong Chin Hui, Lee Choon Kuan |
2003-01-14 |
