Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7208828 | Semiconductor package with wire bonded stacked dice and multi-layer metal bumps | Lee Kian Chai | 2007-04-24 |
V'
Victor Cher 'Khng
Overall (All Time): #3,383,946 of 4,157,543Top 85%
1
Patents All Time