Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394727 | Semiconductor device and method for forming electromagnetic interference (EMI) shielded packages with laser-based redistribution and multi-stacked packages | ChangOh Kim, Seonghwan Park, JinHee Jung | 2025-08-19 |
| 12288753 | Semiconductor device with partial EMI shielding and method of making the same | ChangOh Kim, KyoWang Koo, SungWon Cho | 2025-04-29 |
| 12266615 | Selective EMI shielding using preformed mask with fang design | ChangOh Kim, JinHee Jung, OMin Kwon, Jiwon Lee, YuJeong Jang | 2025-04-01 |
| 12136759 | Antenna-in-package devices and methods of making | HunTeak Lee, Kyunghwan KIM, Seunghyun Lee, Sangjun Park | 2024-11-05 |
| 11990424 | Selective EMI shielding using preformed mask | HunTeak Lee, Kyunghwan KIM, HeeSoo Lee, ChangOh Kim, JinHee Jung +3 more | 2024-05-21 |
| 11862572 | Laser-based redistribution and multi-stacked packages | ChangOh Kim, Seonghwan Park, JinHee Jung | 2024-01-02 |
| 11862478 | Mask design for improved attach position | ChangOh Kim, JinHee Jung, OMin Kwon, Jiwon Lee, YuJeong Jang | 2024-01-02 |
| 11715703 | EMI shielding for flip chip package with exposed die backside | SungWon Cho, ChangOh Kim, Il Kwon Shim, InSang Yoon | 2023-08-01 |
| 11688697 | Emi shielding for flip chip package with exposed die backside | Dong Won Son, ByeongHoon Kim, Sung-Ho Choi, Sung Jae Lim, Jong-Ho Shin +2 more | 2023-06-27 |
| 11664327 | Selective EMI shielding using preformed mask | HunTeak Lee, Kyunghwan KIM, HeeSoo Lee, ChangOh Kim, JinHee Jung +3 more | 2023-05-30 |
| 11616025 | Selective EMI shielding using preformed mask with fang design | ChangOh Kim, JinHee Jung, OMin Kwon, Jiwon Lee, YuJeong Jang | 2023-03-28 |
| 11610847 | Laser-based redistribution and multi-stacked packages | ChangOh Kim, Seonghwan Park, JinHee Jung | 2023-03-21 |
| 11594438 | Semiconductor manufacturing device to securely hold semiconductor panels for transport and manufacturing processes | HyeonChul LEE, Kyunghwan KIM | 2023-02-28 |
| 11393698 | Mask design for improved attach position | ChangOh Kim, JinHee Jung, OMin Kwon, Jiwon Lee, YuJeong Jang | 2022-07-19 |
| 11355452 | EMI shielding for flip chip package with exposed die backside | Dong Won Son, ByeongHoon Kim, Sung-Ho Choi, Sung Jae Lim, Jong-Ho Shin +2 more | 2022-06-07 |
| 11342278 | EMI shielding for flip chip package with exposed die backside | SungWon Cho, ChangOh Kim, Il Kwon Shim, InSang Yoon | 2022-05-24 |
| 11145603 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more | 2021-10-12 |
| 11088082 | Semiconductor device with partial EMI shielding and method of making the same | ChangOh Kim, KyoWang Koo, SungWon Cho | 2021-08-10 |
| 11024585 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more | 2021-06-01 |
| 10804217 | EMI shielding for flip chip package with exposed die backside | SungWon Cho, ChangOh Kim, Il Kwon Shim, InSang Yoon | 2020-10-13 |
| 10134664 | Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof | Minkyung Kang, YoungDal Roh, Dong Ju Jeon | 2018-11-20 |
| 9997468 | Integrated circuit packaging system with shielding and method of manufacturing thereof | Byung Joon Han, Il Kwon Shim, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more | 2018-06-12 |
| 9607938 | Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof | Minkyung Kang, YoungDal Roh, Dong Ju Jeon | 2017-03-28 |
| 9210816 | Method of manufacture of support system with fine pitch | YoungDal Roh, Dong Ju Jeon, HyungSang Park | 2015-12-08 |
| 9171795 | Integrated circuit packaging system with embedded component and method of manufacture thereof | Dong Ju Jeon, YoungDal Roh, JinHee Jung | 2015-10-27 |