Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688697 | Emi shielding for flip chip package with exposed die backside | Dong Won Son, ByeongHoon Kim, Sung-Ho Choi, Jong-Ho Shin, SungWon Cho +2 more | 2023-06-27 |
| 11355452 | EMI shielding for flip chip package with exposed die backside | Dong Won Son, ByeongHoon Kim, Sung-Ho Choi, Jong-Ho Shin, SungWon Cho +2 more | 2022-06-07 |
| 9244119 | Apparatus for testing a semiconductor package | Gui-Heum CHOI, In Sik Kim, Bo-Keun Shim | 2016-01-26 |