Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955456 | Flip chip packaged devices with thermal pad | Anindya Poddar, Ashok S. Prabhu, Hau Nguyen, Makoto Shibuya | 2024-04-09 |
| 8650748 | Universal chip carrier and method | Artur Darbinyan, David Chin | 2014-02-18 |