Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8148643 | Multilayered printed circuit board and manufacturing method thereof | Naohiro Hirose, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Naoto Ishida +2 more | 2012-04-03 |
| 8065794 | Printed wiring board and its manufacturing method | Honchin En, Tohru Nakai, Takeo Oki, Naohiro Hirose | 2011-11-29 |
| 8021748 | Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same | Motoo Asai, Yasushi Inagaki | 2011-09-20 |
| 7832098 | Method of manufacturing a multilayered printed circuit board | Naohiro Hirose, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Naoto Ishida +2 more | 2010-11-16 |
| 7827680 | Electroplating process of electroplating an elecrically conductive sustrate | Honchin En, Tohru Nakai, Takeo Oki, Naohiro Hirose | 2010-11-09 |
| 7691189 | Printed wiring board and its manufacturing method | Honchin En, Tohru Nakai, Takeo Oki, Naohiro Hirose | 2010-04-06 |
| RE40947 | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole | Motoo Asai, Kenichi Shimada, Takashi Kariya, Hiroshi Segawa | 2009-10-27 |
| 7415761 | Method of manufacturing multilayered circuit board | Naohiro Hirose, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Naoto Ishida +2 more | 2008-08-26 |
| 7230188 | Printed wiring board and its manufacturing method | Honchin En, Tohru Nakai, Takeo Oki, Naohiro Hirose | 2007-06-12 |
| 6762921 | Multilayer printed-circuit board and method of manufacture | Motoo Asai, Takashi Kariya | 2004-07-13 |
| 6591495 | Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating | Naohiro Hirose, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Naoto Ishida +2 more | 2003-07-15 |
| 6512186 | Multilayer printed wiring board having a roughened inner conductor layer and production method thereof | Yoko Nishiwaki | 2003-01-28 |
| 6376052 | Multilayer printed wiring board and its production process, resin composition for filling through-hole | Motoo Asai, Ken Shimada, Takashi Kariya, Hiroshi Segawa | 2002-04-23 |
| 6376049 | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole | Motoo Asai, Kenichi Shimada, Takashi Kariya, Hiroshi Segawa | 2002-04-23 |
| 6261671 | Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board | Motoo Asai, Yoshitaka Ono, Masato Kawade, Youko Nishiwaki | 2001-07-17 |
| 6248428 | Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board | Motoo Asai, Yoshitaka Ono, Masato Kawade, Youko Nishiwaki | 2001-06-19 |
| 5841190 | High density multi-layered printed wiring board, multi-chip carrier and semiconductor package | Tooru Inoue, Benzhen Yuan | 1998-11-24 |