Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8148643 | Multilayered printed circuit board and manufacturing method thereof | Naohiro Hirose, Kouta Noda, Hiroshi Segawa, Kiyotaka Tsukada, Naoto Ishida +2 more | 2012-04-03 |
| 7847318 | Multilayer build-up wiring board including a chip mount region | Naohiro Hirose | 2010-12-07 |
| 7832098 | Method of manufacturing a multilayered printed circuit board | Naohiro Hirose, Kouta Noda, Hiroshi Segawa, Kiyotaka Tsukada, Naoto Ishida +2 more | 2010-11-16 |
| 7514779 | Multilayer build-up wiring board | Naohiro Hirose | 2009-04-07 |
| 7415761 | Method of manufacturing multilayered circuit board | Naohiro Hirose, Kouta Noda, Hiroshi Segawa, Kiyotaka Tsukada, Naoto Ishida +2 more | 2008-08-26 |
| 6613986 | Multilayer build-up wiring board | Naohiro Hirose | 2003-09-02 |
| 6591495 | Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating | Naohiro Hirose, Kouta Noda, Hiroshi Segawa, Kiyotaka Tsukada, Naoto Ishida +2 more | 2003-07-15 |