KL

Kian-Hock Lim

AP Advanpack Solutions Pte: 10 patents #3 of 37Top 9%
📍 Singapore, SG: #672 of 13,971 inventorsTop 5%
Overall (All Time): #456,204 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
10763133 Semiconductor structure and semiconductor package device using the same Jimmy Chew, Oviso Dominador Jr Fortaleza, Shoa-Siong Raymond Lim 2020-09-01
10109503 Method of manufacturing semiconductor package device Jimmy Chew, Oviso Dominador Jr Fortaleza, Shoa-Siong Raymond Lim 2018-10-23
9847268 Semiconductor package and manufacturing method thereof Shoa-Siong Raymond Lim 2017-12-19
9583449 Semiconductor package Hwee-Seng Jimmy Chew, Oviso Dominador Jr Fortaleza, Shoa-Siong Raymond Lim 2017-02-28
9305868 Manufacturing method of forming an etch-back type semiconductor package with locking anchorages Hwee-Seng Jimmy Chew, Shoa-Siong Raymond Lim 2016-04-05
9219027 Semiconductor device carrier and semiconductor package using the same Hwee-Seng Jimmy Chew, Oviso Dominador Jr Fortaleza, Shoa-Siong Raymond Lim 2015-12-22
9120169 Method for device packaging Hwee-Seng Jimmy Chew, Chee Kian Ong, Amlan Sen, Shoa-Siong Raymond Lim 2015-09-01
9059050 Manufacturing methods of semiconductor substrate, package and device Shoa-Siong Raymond Lim 2015-06-16
8917521 Etch-back type semiconductor package, substrate and manufacturing method thereof Hwee-Seng Jimmy Chew, Shoa-Siong Raymond Lim 2014-12-23
8709874 Manufacturing method for semiconductor device carrier and semiconductor package using the same Hwee-Seng Jimmy Chew, Oviso Dominador Jr Fortaleza, Shoa-Siong Raymond Lim 2014-04-29
8664750 Semiconductor substrate, package and device Shoa-Siong Raymond Lim 2014-03-04