Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734311 | Hybrid lead frame for semiconductor die package with improved creepage distance | Mariano Layson Ching, Jr., Burton J. Carpenter, Lidong Zhang, Quan Chen, Meng Kong Lye | 2020-08-04 |
| 7808117 | Integrated circuit having pads and input/output (I/O) cells | Nhat Vo, Tu-Anh N. Tran, Burton J. Carpenter, Dae Young Hong, James W. Miller | 2010-10-05 |