Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9299675 | Embedded die ball grid array package | Navas Khan Oratti Kalandar, Boon Yew Low | 2016-03-29 |
| 9064718 | Pre-formed via array for integrated circuit package | Navas Khan Oratti Kalandar | 2015-06-23 |
| 9034694 | Embedded die ball grid array package | Navas Khan Oratti Kalandar, Boon Yew Low | 2015-05-19 |
| 8980696 | Method of packaging semiconductor die | Dominic Koey Poh Meng, Zhiwei Gong, Weng F. Yap | 2015-03-17 |
| 8945989 | Stiffened semiconductor die package | Navas Khan Oratti Kalandar | 2015-02-03 |
| 8853058 | Method of making surface mount stacked semiconductor devices | Navas Khan Oratti Kalandar, Lan Chu Tan | 2014-10-07 |
| 8836098 | Surface mount semiconductor device with solder ball reinforcement frame | Norazham Mohd Sukemi, Navas Khan Oratti Kalandar | 2014-09-16 |
| 8810020 | Semiconductor device with redistributed contacts | Navas Khan Oratti Kalandar, Chee Seng Foong, Norazham Mohd Sukemi | 2014-08-19 |
| 8772913 | Stiffened semiconductor die package | Navas Khan Oratti Kalandar | 2014-07-08 |
| 8669140 | Method of forming stacked die package using redistributed chip packaging | Navas Khan Oratti Kalandar, Lan Chu Tan | 2014-03-11 |