Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9312253 | Heterogeneous integration of memory and split-architecture processor | Kurt Peter Wachtler | 2016-04-12 |
| 8957525 | 3D semiconductor interposer for heterogeneous integration of standard memory and split-architecture processor | Kurt Peter Wachtler | 2015-02-17 |
| 8053349 | BGA package with traces for plating pads under the chip | Kenneth Robert Rhyner, David G. Wontor, Peter R. Harper | 2011-11-08 |
| 7449364 | Device and method for including passive components in a chip scale package | — | 2008-11-11 |
| 7105923 | Device and method for including passive components in a chip scale package | — | 2006-09-12 |
| 6689634 | Modeling technique for selectively depopulating electrical contacts from a foot print of a grid array (BGA or LGA) package to increase device reliability | — | 2004-02-10 |
| 6285560 | Method for increasing device reliability by selectively depopulating solder balls from a foot print of a ball grid array (BGA) package, and device so modified | — | 2001-09-04 |