Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6618940 | Fine pitch circuitization with filled plated through holes | Curtis Miller, Thomas R. Miller, Robert David Sebesta, James Warren Wilson, Michael Wozniak | 2003-09-16 |
| 6379772 | Avoiding polymer fill of alignment sites | — | 2002-04-30 |
| 6291779 | Fine pitch circuitization with filled plated through holes | Curtis Miller, Thomas R. Miller, Robert David Sebesta, James Warren Wilson, Michael Wozniak | 2001-09-18 |
| 5827386 | Method for forming a multi-layered circuitized substrate member | Ashwinkumar C. Bhatt, Mark Daniel Derwin | 1998-10-27 |