Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11024520 | Substrate processing apparatus | Toshio Yokoyama | 2021-06-01 |
| 10468274 | Substrate processing apparatus | Toshio Yokoyama | 2019-11-05 |
| 10141211 | Substrate processing apparatus and substrate transfer method | Toshio Yokoyama, Masahiko Sekimoto, Kenichi Kobayashi, Kenichi Akazawa, Takashi Mitsuya | 2018-11-27 |
| 9786532 | Substrate processing apparatus and method of transferring a substrate | Toshio Yokoyama, Masahiko Sekimoto, Kenichi Kobayashi, Kenichi Akazawa, Takashi Mitsuya | 2017-10-10 |
| 9633898 | Etching liquid, etching method, and method of manufacturing solder bump | Akira Susaki | 2017-04-25 |
| 9556533 | Substrate processing apparatus and substrate processing method | Tsutomu Nakada | 2017-01-31 |
| 8029653 | Electroplating apparatus and electroplating method | Satoru Yamamoto, Takashi Kawakami, Tsutomu Nakada, Hiroyuki Kanda, Junji Kunisawa +1 more | 2011-10-04 |
| 7736474 | Plating apparatus and plating method | Mizuki Nagai, Satoru Yamamoto, Hiroyuki Kanda, Koji Mishima, Shinya Morisawa +7 more | 2010-06-15 |
| 7553400 | Plating apparatus and plating method | Mizuki Nagai, Hiroyuki Kanda, Satoru Yamamoto, Ryoichi Kimizuka, Hariklia Deligianni +4 more | 2009-06-30 |
| 7479213 | Plating method and plating apparatus | Mizuki Nagai, Hiroyuki Kanda, Satoru Yamamoto, Hidenao Suzuki, Koji Mishima +3 more | 2009-01-20 |
| 7311809 | Plating apparatus for substrate | Mizuki Nagai, Satoru Yamamoto, Hiroyuki Kanda, Koji Mishima, Brett Baker +2 more | 2007-12-25 |