Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10894899 | Nanocellulose-based anti-fogging composition | Yinyong Li | 2021-01-19 |
| 10543476 | Porous materials, methods of manufacture thereof and articles comprising the same | Yinyong Li, Kara L. Martin | 2020-01-28 |
| 8163188 | Article with PHEMA lift-off layer and method therefor | Sarav Bharat Jhaveri | 2012-04-24 |
| 7982312 | Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning | Matthew E. Colburn, Gary M. McClelland, Dirk Pfeiffer | 2011-07-19 |
| 7947801 | Polyfluorene method | Sarav Bharat Jhaveri | 2011-05-24 |
| 7862989 | Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning | Matthew E. Colburn, Gary M. McClelland, Dirk Pfeiffer | 2011-01-04 |
| 7837459 | Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning | Matthew E. Colburn, Gary M. McClelland, Dirk Pfeiffer | 2010-11-23 |
| 7559418 | Method of exchanging coins involving non-cash exchange options | — | 2009-07-14 |
| 7435074 | Method for fabricating dual damascence structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascence patterning | Matthew E. Colburn, Gary M. McClelland, Dirk Pfeiffer | 2008-10-14 |
| 7163454 | System and method for managing dispensation and reconciliation of coins | — | 2007-01-16 |
| 7151029 | Memory device and method of making the same | Luisa D. Bozano, John Campbell Scott | 2006-12-19 |
| 6987689 | Non-volatile multi-stable memory device and methods of making and using the same | Luisa D. Bozano, John Campbell Scott | 2006-01-17 |
| 6900126 | Method of forming metallized pattern | Mark Whitney Hart, Craig J. Hawker, John Campbell Scott | 2005-05-31 |
| 6730617 | Method of fabricating one or more tiers of an integrated circuit | — | 2004-05-04 |
| 6531343 | Method of encapsulating a circuit assembly | Craig J. Hawker, James L. Hedrick, Robert D. Miller, Michael A. Gaynes, Stephen L. Buchwalter | 2003-03-11 |
| 6518392 | Dielectric compositions, preparation thereof, and integrated circuit devices fabricated therewith | James L. Hedrick, Victor Yee-Way Lee, Dale Curtis McHerron, Robert D. Miller | 2003-02-11 |
| 6342455 | Process for forming an integrated circuit | James L. Hedrick, Victor Yee-Way Lee, Dale Curtis McHerron, Robert D. Miller | 2002-01-29 |
| 6333141 | Process for manufacture of integrated circuit device using inorganic/organic matrix comprising polymers of three dimensional architecture | Richard Anthony DiPietro, Craig J. Hawker, James L. Hedrick, Victor Y. Lee, Robert D. Miller +2 more | 2001-12-25 |
| 6326237 | Reworkable thermoplastic hyper-branched encapsulant | Craig J. Hawker, James L. Hedrick, Robert D. Miller, Michael A. Gaynes, Stephen L. Buchwalter | 2001-12-04 |
| 6265753 | Interconnect dielectric compositions, preparation thereof, and integrated circuit devices fabricated therewith | James L. Hedrick, Victor Yee-Way Lee, Dale Curtis McHerron, Robert D. Miller | 2001-07-24 |
| 6177360 | Process for manufacture of integrated circuit device | Robert Cook, Martha Alyne Harbison, Craig J. Hawker, James L. Hedrick, Victor Yee-Way Lee +4 more | 2001-01-23 |
| 6143643 | Process for manufacture of integrated circuit device using organosilicate insulative matrices | Craig J. Hawker, James L. Hedrick, Victor Y. Lee, Robert D. Miller, Willi Volksen +1 more | 2000-11-07 |
| 6110649 | Process for manufacture of integrated circuit device | Craig J. Hawker, James L. Hedrick, Robert D. Miller, Bernhard Pogge | 2000-08-29 |
| 6111323 | Reworkable thermoplastic encapsulant | Craig J. Hawker, James L. Hedrick, Robert D. Miller, Michael A. Gaynes, Stephen L. Buchwalter | 2000-08-29 |
| 6093636 | Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets | Daniel J. Dawson, Craig J. Hawker, James L. Hedrick, Jeffrey Hedrick, Victor Y. Lee +3 more | 2000-07-25 |