| 9773725 |
Coreless multi-layer circuit substrate with minimized pad capacitance |
Mahesh Bohra, Jinwoo Choi, Tae Hong Kim, Rohan U. Mandrekar |
2017-09-26 |
| 9548769 |
Reduced wiring requirements with signal slope manipulation |
Mahesh Bohra, Jinwoo Choi, Lloyd A. Walls |
2017-01-17 |
| 9060428 |
Coreless multi-layer circuit substrate with minimized pad capacitance |
Mahesh Bohra, Jinwoo Choi, Tae Tong Kim, Rohan U. Mandrekar |
2015-06-16 |
| 8975525 |
Corles multi-layer circuit substrate with minimized pad capacitance |
Mahesh Bohra, Jinwoo Choi, Tae Hong Kim, Rohan U. Mandrekar |
2015-03-10 |
| 8743558 |
Reduced wiring requirements with signal slope manipulation |
Mahesh Bohra, Jinwoo Choi, Lloyd A. Walls |
2014-06-03 |
| 8593621 |
Testing an optical fiber connection |
Mahesh Bohra, Hong T. Dang, Rohan U. Mandrekar, Roger D. Weekly |
2013-11-26 |
| 8389870 |
Coreless multi-layer circuit substrate with minimized pad capacitance |
Mahesh Bohra, Jinwoo Choi, Tae Hong Kim, Rohan U. Mandrekar |
2013-03-05 |
| 8358509 |
Reduced wiring requirements with signal slope manipulation |
Mahesh Bohra, Jinwoo Choi, Lloyd A. Walls |
2013-01-22 |
