Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8558362 | Semiconductor device and manufacturing method of the same | Hajime Hasebe | 2013-10-15 |
| 8102035 | Method of manufacturing a semiconductor device | Hajime Hasebe | 2012-01-24 |
| 7948068 | Semiconductor device having a chip mounting portion and a plurality of suspending leads supporting the chip mounting portion and each suspension lead having a bent portion | Hajime Hasebe | 2011-05-24 |
| 7579674 | Semiconductor package configuration with improved lead portion arrangement | Atsushi Fujisawa, Hajime Hasebe | 2009-08-25 |
| 7514293 | Method of manufacturing a semiconductor device | Hajime Hasebe | 2009-04-07 |
| 7429500 | Method of manufacturing a semiconductor device | Hajime Hasebe | 2008-09-30 |
| 7348659 | Semiconductor device and method of manufacturing thereof | Atsushi Fujisawa, Hajime Hasebe | 2008-03-25 |
| 6565662 | Vacuum processing apparatus for semiconductor process | Yoshitsugu Tanaka | 2003-05-20 |
| 6387208 | Inductive coupling plasma processing apparatus | Tsutomu Satoyoshi | 2002-05-14 |
| 6331754 | Inductively-coupled-plasma-processing apparatus | Tsutomu Satoyoshi, Hiromichi Ito, Yoshito Miyazaki | 2001-12-18 |
| 6093087 | Wafer processing machine and a processing method thereby | Shunji Hakomori, Masahiro Ichikawa | 2000-07-25 |
| 5941534 | Hydraulic seal system | Kiminobu Terao, Kouji Ueda, Yorinori Kumagai, Takamichi Shimada, Toshio Oka +1 more | 1999-08-24 |
| 5713578 | Hydraulic sealing device | Kiminobu Terao, Kouji Ueda, Mayumi Takada | 1998-02-03 |