Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7732914 | Cavity-type integrated circuit package | Neil McLellan, Geraldine Tsui Yee Lin, Mohan Kirloskar | 2010-06-08 |
| 7348663 | Integrated circuit package and method for fabricating same | Mohan Kirloskar, Leo M. Higgins, III | 2008-03-25 |
| 7344920 | Integrated circuit package and method for fabricating same | Mohan Kirloskar, Leo M. Higgins, III | 2008-03-18 |