Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424453 | Low temperature direct copper-copper bonding | Stephen J. Banik, II, Justin Oberst, Bryan L. Buckalew, Thomas A. Ponnuswamy | 2025-09-23 |
| 12247310 | Lipseal edge exclusion engineering to maintain material integrity at wafer edge | Justin Oberst, Bryan L. Buckalew | 2025-03-11 |
| 11610782 | Electro-oxidative metal removal in through mask interconnect fabrication | Richard Abraham, Steven T. Mayer | 2023-03-21 |
| 11047059 | Dynamic modulation of cross flow manifold during elecroplating | Aaron Berke, Bryan L. Buckalew, Steven T. Mayer | 2021-06-29 |
| 10692735 | Electro-oxidative metal removal in through mask interconnect fabrication | Richard Abraham, Steven T. Mayer | 2020-06-23 |
| 10364505 | Dynamic modulation of cross flow manifold during elecroplating | Aaron Berke, Bryan L. Buckalew, Steven T. Mayer | 2019-07-30 |
| 8785123 | Direct hierarchical assembly of nanoparticles | Ting Xu, Yue Zhao | 2014-07-22 |