Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227820 | Through hole side wettable flank | Wai Hung William Hor, Sven Walczyk, Hans-Juergen Funke | 2022-01-18 |
| 10410941 | Wafer level semiconductor device with wettable flanks | Chi Ho Leung, Pompeo V. Umali, Shun Tik Yeung | 2019-09-10 |
| 10304759 | Electronic device and method of making same | Shun Tik Yeung, Pompeo V. Umali, Chi Ho Leung, Chi Ling Shum | 2019-05-28 |
| 10262926 | Reversible semiconductor die | Harrie Horstink, Sven Walczyk, Chi Ho Leung, Thierry Jans, Pompeo V. Umali +1 more | 2019-04-16 |
| 10256168 | Semiconductor device and lead frame therefor | Shun Tik Yeung, Pompeo V. Umali, Chi Ho Leung, Hans-Juergen Funke, Shu-ming Yip | 2019-04-09 |
| 10056343 | Packaged semiconductor device with interior polygonal pads | Roelf A. J. Groenhuis, Clifford J. Lloyd, Chi Hoo Wan, Fei Ying Wong | 2018-08-21 |
| 9847283 | Semiconductor device with wettable corner leads | Xue Ke, Sven Walczyk, Wai Keung Ho, Wing Onn Chaw | 2017-12-19 |
| 9640463 | Built-up lead frame package and method of making thereof | Pompeo V. Umali, Chi Ho Leung, Shun Tik Yeung, Chi Ling Shum | 2017-05-02 |
| 9391007 | Built-up lead frame QFN and DFN packages and method of making thereof | Shun Tik Yeung, Pompeo V. Umali, Chi Ho Leung, Chi Ling Shum | 2016-07-12 |
| 9269690 | Packaged semiconductor device with interior polygonal pads | Roelf A. J. Groenhuis, Clifford J. Lloyd, Chi Hoo Wan, Fei Ying Wong | 2016-02-23 |