Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11803262 | Electronic apparatus and method for manufacturing the same | Younghye Son, Sang-Gu Lee, Onnuri Kim | 2023-10-31 |
| 11211444 | Display apparatus | — | 2021-12-28 |
| 10197719 | Display device | Euijeong KANG, Sehee JEON, Hayoung Lee | 2019-02-05 |
| 10088625 | Backlight unit | Youngchun Kim, Byoungdae Ye, Changyong Park | 2018-10-02 |
| 9927569 | Display device | Youngchun Kim, Kyung Min Kim, Byoungdae Ye | 2018-03-27 |
| 9749352 | Apparatus and method for collecting harmful website information | Sangjun Lee | 2017-08-29 |
| 8994196 | System and method for directional grinding on backside of a semiconductor wafer | Sungyoon Lee, BoHan Yoon | 2015-03-31 |
| 8704366 | Ultra thin bumped wafer with under-film | Sangho Lee, Sungyoon Lee | 2014-04-22 |
| 8329554 | Ultra thin bumped wafer with under-film | Sangho Lee, Sungyoon Lee | 2012-12-11 |
| 8232141 | Integrated circuit packaging system with conductive pillars and method of manufacture thereof | DaeSik Choi, JoHyun Bae | 2012-07-31 |
| 8030769 | Grooving bumped wafer pre-underfill system | Sungyoon Lee, Taewoo Lee | 2011-10-04 |
| 7923304 | Integrated circuit packaging system with conductive pillars and method of manufacture thereof | DaeSik Choi, JoHyun Bae | 2011-04-12 |
| 7892072 | Method for directional grinding on backside of a semiconductor wafer | Sungyoon Lee, BoHan Yoon | 2011-02-22 |
| 7838391 | Ultra thin bumped wafer with under-film | Sangho Lee, Sungyoon Lee | 2010-11-23 |
| 7727875 | Grooving bumped wafer pre-underfill system | Sungyoon Lee, Taewoo Lee | 2010-06-01 |