Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11043471 | Mixed-orientation multi-die integrated circuit package with at least one vertically-mounted die | Bomy Chen | 2021-06-22 |
| 10896888 | Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond | Bomy Chen, Andrew Taylor | 2021-01-19 |
| 10818748 | Thin-film resistor (TFR) formed under a metal layer and method of fabrication | Yaojian Leng, Bonnie Hamlin, Andrew Taylor, Janet Vanderiet | 2020-10-27 |
| 10658453 | Aluminum compatible thin-film resistor (TFR) and manufacturing methods | Yaojian Leng, Greg Stom | 2020-05-19 |
| 10553336 | Thin-film resistor (TFR) module with top-side interconnects connected to reduced TFR ridges and manufacturing methods | Yaojian Leng, Greg Stom | 2020-02-04 |
| 10381330 | Sacrificial alignment ring and self-soldering vias for wafer bonding | Bomy Chen, Walter Lundy | 2019-08-13 |
| 10056545 | Sidewall-type memory cell | Bomy Chen, Sonu Daryanani | 2018-08-21 |
| 10002785 | Air-gap assisted etch self-aligned dual Damascene | Andrew Taylor | 2018-06-19 |
| 9953886 | Single-wafer real-time etch rate and uniformity predictor for plasma etch processes | Brian Hennes, Yannick Carll Kimmel | 2018-04-24 |
| 9679844 | Manufacturing a damascene thin-film resistor | Yaojian Leng | 2017-06-13 |
| 9627246 | Method of forming shallow trench isolation (STI) structures | Gregory Allen Stom | 2017-04-18 |
| 9589828 | Method for photolithography-free self-aligned reverse active etch | Gregory Allen Stom | 2017-03-07 |
| 9444040 | Sidewall type memory cell | Bomy Chen, Sonu Daryanani | 2016-09-13 |
| 8853091 | Method for manufacturing a semiconductor die with multiple depth shallow trench isolation | Brian Hennes, Greg Stom, Robert P. Ma, Walter Lundy | 2014-10-07 |