Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424453 | Low temperature direct copper-copper bonding | Stephen J. Banik, II, Kari Thorkelsson, Bryan L. Buckalew, Thomas A. Ponnuswamy | 2025-09-23 |
| 12247310 | Lipseal edge exclusion engineering to maintain material integrity at wafer edge | Bryan L. Buckalew, Kari Thorkelsson | 2025-03-11 |
| 11450631 | Alternative integration for redistribution layer process | Bryan L. Buckalew, Stephen J. Banik, II | 2022-09-20 |
| 11001934 | Methods and apparatus for flow isolation and focusing during electroplating | Stephen J. Banik, II, Bryan L. Buckalew, Aaron Berke, James Isaac Fortner, Steven T. Mayer +1 more | 2021-05-11 |
| 10714436 | Systems and methods for achieving uniformity across a redistribution layer | Bryan L. Buckalew, Thomas A. Ponnuswamy, Steven T. Mayer, Stephen J. Banik, II | 2020-07-14 |