Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12089337 | Circuit board | — | 2024-09-10 |
| 11715821 | Electronic element module and printed circuit board for the same | — | 2023-08-01 |
| 11259404 | Rigid-flexible printed circuit board and electronic component module | Jae Ho Shin, Yun Je Ji | 2022-02-22 |
| 11172574 | Printed circuit board assembly | Jae Ho Shin, Yun Je Ji, Tae-Seong Kim | 2021-11-09 |
| 11134576 | Printed circuit board | — | 2021-09-28 |
| 10833041 | Fan-out semiconductor package | Ki Jung SUNG | 2020-11-10 |
| 10396037 | Fan-out semiconductor device | Kwang Yun KIM, Ki Jung SUNG | 2019-08-27 |
| 10283439 | Fan-out semiconductor package including electromagnetic interference shielding layer | Jung-Hyun Cho, Yong Ho Baek, Joo Hwan Jung, Moon Hee Yi | 2019-05-07 |
| 10026678 | Fan-out semiconductor package | Jung-Hyun Cho, Yong Ho Baek, Joo Hwan Jung, Moon Hee Yi | 2018-07-17 |
| 8633396 | Die mounting substrate and method of fabricating the same | Eung-Suek Lee, Jee-Soo Mok | 2014-01-21 |
| 8377748 | Method of manufacturing cooling fin and package substrate with cooling fin | Eung-Suek Lee, Je-Gwang Yoo, Chang-Sup Ryu, Jun Heyoung Park, Jee-Soo Mok | 2013-02-19 |
| 8166647 | Method of manufacturing a printed circuit board | Jee-Soo Mok, Jun Heyoung Park, Kyung Ah Lee, Eung-Suek Lee | 2012-05-01 |