Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12114428 | Electronic component embedded substrate | Yong Hoon Kim, Seung Eun Lee | 2024-10-08 |
| 11963311 | Printed circuit board and method of manufacturing the same | Jae Woong Choi, Seung Eun Lee, Yong Hoon Kim | 2024-04-16 |
| 11882652 | Printed circuit board | Seung Eun Lee, Yong Hoon Kim | 2024-01-23 |
| 11439020 | Electronic component-embedded substrate | Yong Hoon Kim | 2022-09-06 |
| 11315879 | Package substrate and multi-chip package including the same | Tae-Seong Kim | 2022-04-26 |
| 11259404 | Rigid-flexible printed circuit board and electronic component module | Jun Oh Hwang, Jae Ho Shin | 2022-02-22 |
| 11206736 | Connection substrate and interposer substrate including the same | Yong Hoon Kim, Jin Won Lee | 2021-12-21 |
| 11172574 | Printed circuit board assembly | Jae Ho Shin, Jun Oh Hwang, Tae-Seong Kim | 2021-11-09 |
| 11076485 | Component mounted board and electronic device comprising the same | Tae-Seong Kim, Ho Kwon Yoon, Yong Hoon Kim | 2021-07-27 |
| 6672902 | Reducing electromagnetic interference (EMI) emissions | Harry G. Skinner, Steve Chang, Howard L. Heck | 2004-01-06 |