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Free standing, three dimensional, multi-chip, carrier package with air flow baffle |
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2001-07-03 |
| 6075287 |
Integrated, multi-chip, thermally conductive packaging device and methodology |
Anthony P. Ingraham, Glenn L. Kehley, Sanjeev Sathe |
2000-06-13 |
| 6061245 |
Free standing, three dimensional, multi-chip, carrier package with air flow baffle |
Anthony P. Ingraham, Glenn L. Kehley, Sanjeev Sathe |
2000-05-09 |
| 6037658 |
Electronic package with heat transfer means |
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2000-03-14 |
| 5926369 |
Vertically integrated multi-chip circuit package with heat-sink support |
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1999-07-20 |
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1997-09-23 |
| 4602733 |
Desoldering apparatus and method |
William Ditlef VON Voss |
1986-07-29 |
