Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9123663 | Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductor | OhHan Kim, Seungwon Kim | 2015-09-01 |
| 8137995 | Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures | OhHan Kim, Sunmi Kim | 2012-03-20 |
| 8035211 | Integrated circuit package system with support structure under wire-in-film adhesive | WonJun Ko, BoHan Yoon | 2011-10-11 |