Issued Patents All Time
Showing 1–25 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406915 | Plated metal layer in power packages | Makarand Ramkrishna Kulkarni, Osvaldo Jorge Lopez, Yiqi Tang, Rajen Manicon Murugan, Liang Wan | 2025-09-02 |
| 12243809 | Packaged electronic device with film isolated power stack | Tianyi Luo, Osvaldo Jorge Lopez | 2025-03-04 |
| 12176274 | Multi-die package with multiple heat channels | Osvaldo Jorge Lopez, Tianyi Luo | 2024-12-24 |
| 12148556 | Integrated magnetic assembly | Yiqi Tang, Rajen Manicon Murugan | 2024-11-19 |
| 12015019 | Stacked die multichip module package | Makarand Ramkrishna Kulkarni | 2024-06-18 |
| 11930590 | Stress relief for flip-chip packaged devices | Tianyi Luo, Osvaldo Jorge Lopez, Satyendra Singh Chauhan, Bernardo Gallegos | 2024-03-12 |
| 11908780 | Semiconductor package with solder standoff | Satyendra Singh Chauhan, Lance Cole Wright, Osvaldo Jorge Lopez | 2024-02-20 |
| 11817375 | High I/O density flip-chip QFN | Osvaldo Jorge Lopez, Tianyi Luo | 2023-11-14 |
| 11784114 | Plated metal layer in power packages | Makarand Ramkrishna Kulkarni, Osvaldo Jorge Lopez, Yiqi Tang, Rajen Manicon Murugan, Liang Wan | 2023-10-10 |
| 11658130 | Conductive plate stress reduction feature | Tianyi Luo, Satyendra Singh Chauhan, Osvaldo Jorge Lopez, Lance Cole Wright | 2023-05-23 |
| 11640932 | Packaged electronic device with film isolated power stack | Tianyi Luo, Osvaldo Jorge Lopez | 2023-05-02 |
| 11177197 | Semiconductor package with solder standoff | Satyendra Singh Chauhan, Lance Cole Wright, Osvaldo Jorge Lopez | 2021-11-16 |
| 11177246 | Photo-sensitive silicon package embedding self-powered electronic system | Osvaldo Jorge Lopez, Walter Hans Paul Schroen, Thomas E. Grebs, Simon John Molloy | 2021-11-16 |
| 11081472 | Stacked die multichip module package | Makarand Ramkrishna Kulkarni | 2021-08-03 |
| 11043477 | Power converter monolithically integrating transistors, carrier, and components | Osvaldo Jorge Lopez, Haian Lin | 2021-06-22 |
| 11024564 | Packaged electronic device with film isolated power stack | Tianyi Luo, Osvaldo Jorge Lopez | 2021-06-01 |
| 10930582 | Semiconductor device having terminals directly attachable to circuit board | Osvaldo Jorge Lopez | 2021-02-23 |
| 10826487 | Power unit with an integrated pull-down transistor | Haian Lin, Frank Baiocchi, Scott E. Ragona | 2020-11-03 |
| 10438936 | Photo-sensitive silicon package embedding self-powered electronic system | Osvaldo Jorge Lopez, Walter Hans Paul Schroen, Thomas E. Grebs, Simon John Molloy | 2019-10-08 |
| 10396016 | Leadframe inductor | Joyce Marie Mullenix, Roberto Giampiero Massolini, Kristen Nguyen Parrish, Osvalod Jorge Lopez | 2019-08-27 |
| 10153220 | Silicon package having electrical functionality by embedded passive components | Osvaldo Jorge Lopez, Thomas E. Grebs, Simon John Molloy | 2018-12-11 |
| 10121716 | Silicon package for embedded semiconductor chip and power converter | Osvaldo Jorge Lopez, Tom Grebs, Simon John Molloy | 2018-11-06 |
| 10109614 | Silicon package for embedded electronic system having stacked semiconductor chips | Osvaldo Jorge Lopez, Thomas E. Grebs, Simon John Molloy | 2018-10-23 |
| 10062624 | Silicon package for embedded semiconductor chip and power converter | Osvaldo Jorge Lopez, Tom Grebs, Simon John Molloy | 2018-08-28 |
| 10050025 | Power converter monolithically integrating transistors, carrier, and components | Osvaldo Jorge Lopez, Haian Lin | 2018-08-14 |