Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7071100 | Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process | Kei-Wei Chen, Jung-Chih Tsao, Chi-Wen Liu, Shih-Tzung Chang, Shih-Ho Lin +2 more | 2006-07-04 |