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2023-06-27 |
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Die encapsulation in oxide bonded wafer stack |
John J. Drab |
2020-09-22 |
| 10581177 |
High frequency polymer on metal radiator |
Robert S. Isom, Andrew J. Marquette |
2020-03-03 |
| 10541461 |
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Mary A. Teshiba, Kevin C. Rolston, John J. Drab |
2020-01-21 |
| 10446466 |
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Tse E. Wong, Yung-Cheng Lee |
2019-10-15 |
| 10242967 |
Die encapsulation in oxide bonded wafer stack |
John J. Drab |
2019-03-26 |
| 9960101 |
Micro-hoses for integrated circuit and device level cooling |
— |
2018-05-01 |
| 9893430 |
Short coincident phased slot-fed dual polarized aperture |
Allen Wang, Fangchou Yang, Jar Jueh Lee |
2018-02-13 |
| 9502330 |
Coolant distribution structure for monolithic microwave integrated circuits (MMICs) |
Anurag Gupta, David H. Altman, Christopher R. Koontz |
2016-11-22 |
| 9218989 |
Aerogel dielectric layer |
Mark S. Hauhe, Terry C. Cisco, Paul Nahass, George L. Gould, Nick Zafiropoulos |
2015-12-22 |
| 8982931 |
RF puck |
John P. Gianvittorio, Frederick A. Dominski |
2015-03-17 |
| 8921992 |
Stacked wafer with coolant channels |
Christopher R. Koontz, Tse E. Wong |
2014-12-30 |
| 8653673 |
Method for packaging semiconductors at a wafer level |
Robert B. Hallock, William John Davis, Yiwen Zhang, Ward G. Fillmore, Susan C. Trulli |
2014-02-18 |
| 8648759 |
Variable height radiating aperture |
Allen Wang, Fangchou Yang |
2014-02-11 |
| 8209846 |
Methods for producing large flat panel and conformal active array antennas |
Avery Y. Quil, Clifton Quan, Alec Ekrnekjl |
2012-07-03 |
| 7631414 |
Methods for producing large flat panel and conformal active array antennas |
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2009-12-15 |
