Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5304847 | Direct thermocompression bonding for thin electronic power chips | Constantine A. Neugebauer, Homer H. Glascock, II, Kyung Wook Paik | 1994-04-19 |
| 5206186 | Method for forming semiconductor electrical contacts using metal foil and thermocompression bonding | Constantine A. Neugebauer, Homer H. Glascock, II, Kyung Wook Paik | 1993-04-27 |
| 5184206 | Direct thermocompression bonding for thin electronic power chips | Constantine A. Neugebauer, Homer H. Glascock, II, Kyung Wook Paik, Martha M. Neugebauer | 1993-02-02 |
| 4764485 | Method for producing via holes in polymer dielectrics | James A. Loughran, Alexander J. Yerman | 1988-08-16 |