Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12365584 | Methods and apparatus for electronic device packaging | Richard Chen, William R. Morrison | 2025-07-22 |
| 11894313 | Substrate processing and packaging | Bradley Morgan Haskett | 2024-02-06 |
| 11807522 | Encapsulant barrier | Gary Philip Thomson, Richard Richter | 2023-11-07 |
| 11145782 | Processing an optical device | Gary Philip Thomson | 2021-10-12 |
| 10710875 | Encapsulant barrier | Gary Philip Thomson, Richard Richter | 2020-07-14 |
| 9520307 | Method and nozzle for hermetically sealed packaged devices | Edward Fisher | 2016-12-13 |
| 7898724 | Thermal conduction by encapsulation | Frank Armstrong, Edward Fisher, Scott Patrick Overmann, Leatrice Lea Gallman Adams | 2011-03-01 |
| 6451660 | Method of forming bipolar transistors comprising a native oxide layer formed on a substrate by rinsing the substrate in ozonated water | Yi Ma, Yih-Feng Chyan, Chung Wai Leung, Timothy Campbell | 2002-09-17 |
| 5950096 | Process for improving device yield in integrated circuit fabrication | Robert Huang, David K. Hwang, Stephen C. Kuehne, Jean L. Lee, Yi Ma +1 more | 1999-09-07 |