Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11990399 | Device with dummy metallic traces | — | 2024-05-21 | $90,556,000 |
| 11235971 | Singulation of wafer level packaging | Clayton Lee Stevenson | 2022-02-01 | $20,446,000 |
| 10611632 | Singulation of wafer level packaging | Clayton Lee Stevenson | 2020-04-07 | $21,870,000 |
| 7898724 | Thermal conduction by encapsulation | Jane Qian Liu, Edward Fisher, Scott Patrick Overmann, Leatrice Lea Gallman Adams | 2011-03-01 | $7,861,000 |
| 7402458 | Stress relieved flat frame for DMD window | Bradley Morgan Haskett, John P. O'Connor, Steven Edward Smith, Mark Myron Miller, Ivan Kmecko +4 more | 2008-07-22 | $4,786,000 |
| 6894853 | Stress relieved frame | Bradley Morgan Haskett, John P. O'Connor, Steven Edward Smith, Mark Myron Miller, Ivan Kmecko +4 more | 2005-05-17 | $18,314,000 |
| 6722210 | System and method for measuring air flow at multiple points of an air channel | Thomas R. Johnston | 2004-04-20 | $14,356,000 |
| 5482612 | Methods and systems for shielding in sputtering chambers | Brian Jeffreys | 1996-01-09 | $5,653,000 |