Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Singulation of wafer level packaging

Singulation of wafer level packaging

US Patent 11235971 · Granted Feb 1, 2022

Estimated economic value: $20,446,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device with dummy metallic traces2024
Singulation of wafer level packaging2020
Singulation of wafer level packaging2020
Semiconductor device structures and their fabrication2013
Mems device and fabrication method2013
MEMS device and fabrication method2012
Hinge design for enhanced optical performance for a digital micro-mirror device2011
Thermal conduction by encapsulation2011
Stress relieved flat frame for DMD window2008
Hinge design for enhanced optical performance for a micro-mirror device2007
Stress relieved frame2005
System and method for measuring air flow at multiple points of an air channel2004