| 12046526 |
Methods of fabricating semiconductor package |
Jung-Ho Park, Jin-Woo Park, Gwang Jae Jeon |
2024-07-23 |
| 12009277 |
Semiconductor package |
Dong Kyu Kim, Jung-Ho Park, Jong Youn Kim, Yeon Ho JANG |
2024-06-11 |
| 11715645 |
Method for fabricating semiconductor package |
Jung-Ho Park, Jin-Woo Park, Seok Hyun LEE, Gwang Jae Jeon |
2023-08-01 |
| 11404346 |
Semiconductor package |
Dong Kyu Kim, Jung-Ho Park, Jong Youn Kim, Yeon Ho JANG |
2022-08-02 |
| 11328970 |
Methods of fabricating semiconductor package |
Jung-Ho Park, Jin-Woo Park, Gwang Jae Jeon |
2022-05-10 |
| 11322368 |
Method for fabricating semiconductor package |
Jung-Ho Park, Jin-Woo Park, Seok Hyun LEE, Gwang Jae Jeon |
2022-05-03 |
| 11121064 |
Semiconductor package |
Jung-Ho Park, Da Hye Kim, Jin-Woo Park |
2021-09-14 |
| 10923650 |
Magneto-resistive chip package including shielding structure |
Baik Woo Lee, Young Jae Kim |
2021-02-16 |
| 10074799 |
Magneto-resistive chip package including shielding structure |
Baik Woo Lee, Young Jae Kim |
2018-09-11 |
| 9893020 |
Semiconductor device |
Baik Woo Lee, Eun-Seok Song, Young Jae Kim |
2018-02-13 |
| 9627327 |
Semiconductor package and method of manufacturing the same |
Baik Woo Lee, Dong Hun Lee, Chul-Yong Jang |
2017-04-18 |
| 9224699 |
Method of manufacturing semiconductor package having magnetic shield unit |
Jin-Woo Park, Jong Ho Lee |
2015-12-29 |
| 9024448 |
Lower semiconductor molding die, semiconductor package, and method of manufacturing the semiconductor package |
Young Lyong Kim, Ae-Nee Jang |
2015-05-05 |
| 8951835 |
Method of fabricating a package substrate |
Seung Wook Park, Young Do Kweon, Jang-Hyun Kim, Tae Seok Park, Su Jeong Suh +3 more |
2015-02-10 |
| 8884446 |
Semiconductor packages |
Young Lyong Kim, Seong-Ho Shin, Jong Ho Lee |
2014-11-11 |
