Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12319563 | Semiconductor package with metal column mold barrier | Rafael Jose Lizares Guevara | 2025-06-03 |
| 12132027 | Semiconductor device assembly with pre-reflowed solder | Steffany Ann Lacierda Moreno, Jose Carlos Arroyo | 2024-10-29 |
| 11742266 | Electronic device topside cooling | Laura May Antoinette Dela Paz Clemente | 2023-08-29 |
| 11600498 | Semiconductor package with flip chip solder joint capsules | Steffany Ann Lacierda Moreno | 2023-03-07 |
| 10593640 | Flip chip integrated circuit packages with spacers | Rafael Jose Lizares Guevara | 2020-03-17 |
| 9564410 | Semiconductor devices having metal bumps with flange | Floro Lopez Camenforte, III, Armando Tresvalles Clarina, Jr. | 2017-02-07 |
| 9219052 | Making a flip-chip assembly with bond fingers | Raymond Partosa, Jesus Bajo Bautista, JR., Roxanna Bauzon Samson | 2015-12-22 |
| 8766461 | Substrate with bond fingers | Raymond Partosa, Jesus Bajo Bautista, JR., Roxanna Bauzon Samson | 2014-07-01 |
| 8381967 | Bonding a solder bump to a lead using compression and retraction forces | Mutsumi Masumoto, Jesus Bajo Bautista, JR., Raymond Partosa | 2013-02-26 |
| 7462943 | Semiconductor assembly for improved device warpage and solder ball coplanarity | Patricio A Ancheta, Jr., Ramil A. Viluan, Elaine B. Reyes | 2008-12-09 |
| 7244636 | Semiconductor assembly for improved device warpage and solder ball coplanarity | Patricio Vergara Ancheta, Ramil A. Viluan, Elaine B. Reyes | 2007-07-17 |