| 7514014 |
High density plasma chemical vapor deposition process |
Chih-Chien Liu, Ta-Shan Tseng, W.B. Shieh, Water Lur, Shih-Wei Sun |
2009-04-07 |
| 6100205 |
Intermetal dielectric layer formation with low dielectric constant using high density plasma chemical vapor deposition process |
Chih-Chien Liu, Tsang-Jung Lin, Water Lur, Shih-Wei Sun |
2000-08-08 |
| 5968610 |
Multi-step high density plasma chemical vapor deposition process |
Chih-Chien Liu, Kuen-Jian Chen, Yu-Hao Chen, Water Lur, Shih-Wei Sun |
1999-10-19 |
| 5944593 |
Retainer ring for polishing head of chemical-mechanical polish machines |
Daniel T. Chiu, C.S. Yang, Peng-Yih Peng, J. S. Lai |
1999-08-31 |
| 5517062 |
Stress released VLSI structure by the formation of porous intermetal layer |
Water Lur |
1996-05-14 |
| 5393709 |
Method of making stress released VLSI structure by the formation of porous intermetal layer |
Water Lur |
1995-02-28 |
| 5358733 |
Stress release metallization for VLSI circuits |
Water Lur |
1994-10-25 |
| 5292680 |
Method of forming a convex charge coupled device |
Water Lur, Jenn-Tarng Lin |
1994-03-08 |
| 5254495 |
Salicide recessed local oxidation of silicon |
Water Lur |
1993-10-19 |