Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446489 | Interconnect structure | Ko-Wei Lin, Hung-Miao Lin, Chun-Ling Lin, Ying-Lien Chen, Sheng-Yi Su | 2019-10-15 |
| 10153231 | Interconnect structure and fabrication method thereof | Ko-Wei Lin, Hung-Miao Lin, Chun-Ling Lin, Ying-Lien Chen, Sheng-Yi Su | 2018-12-11 |
| 10079177 | Method for forming copper material over substrate | Ko-Wei Lin, Ying-Lien Chen, Chun-Ling Lin, Hung-Miao Lin, Sheng-Yi Su +1 more | 2018-09-18 |
| 9412653 | Through silicon via (TSV) process | Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Chun-Ling Lin, Ching-Wei Hsu +2 more | 2016-08-09 |
| 9136170 | Through silicon via (TSV) structure and process thereof | Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Chun-Ling Lin, Ching-Wei Hsu +2 more | 2015-09-15 |
| 9012324 | Through silicon via process | Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Ching-Wei Hsu, Szu-Hao Lai +3 more | 2015-04-21 |