HJ

Hun Jeong

SC Stats Chippac: 3 patents #180 of 425Top 45%
DC Duck Yang Industry Co.: 2 patents #3 of 18Top 20%
HM Hyundai Motor: 2 patents #4,348 of 11,886Top 40%
KM Kia Motors: 2 patents #2,437 of 7,429Top 35%
📍 Ulsan, KR: #122 of 1,040 inventorsTop 15%
Overall (All Time): #971,511 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
10611319 Door trim coupling device for a vehicle Jaeseung Lee, Sun gu Lee, Sae Hoon Oh, Seung Ho Kim 2020-04-07
10065578 Door trim coupling device for a vehicle Jaeseung Lee, Sun gu Lee, Sae Hoon Oh, sueng ho KIM 2018-09-04
8932908 Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die KyuWon Lee, HyunSu Shin, JinGwan Kim, SunYoung Chun 2015-01-13
8502392 Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die KyuWon Lee, HyunSu Shin, JinGwan Kim, SunYoung Chun 2013-08-06
8288202 Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die KyuWon Lee, HyunSu Shin, JinGwan Kim, SunYoung Chun 2012-10-16