Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12408281 | Circuit substrate and electronic device | Ching-Wen Liu | 2025-09-02 |
| 11810835 | Intelligent power module packaging structure | Ching-Wen Liu | 2023-11-07 |
| 11232992 | Power device package structure | Ching-Wen Liu | 2022-01-25 |
| 11183439 | Package structure for power device | Ching-Wen Liu | 2021-11-23 |
| 11177188 | Heat dissipation substrate for multi-chip package | Ching-Wen Liu | 2021-11-16 |
| 11133246 | Semiconductor structure employing conductive paste on lead frame | Chih-Yen Chen, Chun-Yi Wu, Chia-Ching Huang, Chih-Jen Hsiao, Wei-Chan Chang +1 more | 2021-09-28 |
| 11049796 | Manufacturing method of packaging device | Chia-Yen Lee, Peng-Hsin Lee | 2021-06-29 |
| 10892210 | Package structures | Peng-Hsin Lee | 2021-01-12 |
| 10804189 | Power device package structure | — | 2020-10-13 |
| 10741644 | Semiconductor devices with via structure and package structures comprising the same | Shiau-Shi Lin, Tzu-Hsuan Cheng | 2020-08-11 |
| 10685904 | Packaging device and manufacturing method thereof | Chia-Yen Lee, Peng-Hsin Lee | 2020-06-16 |
| 10424508 | Interconnection structure having a via structure and fabrication thereof | Peng-Hsin Lee | 2019-09-24 |
| 10056319 | Power module package having patterned insulation metal substrate | Chia-Yen Lee, Peng-Hsin Lee, Shiau-Shi Lin, Tzu-Hsuan Cheng | 2018-08-21 |
| 9905439 | Power module package having patterned insulation metal substrate | Chia-Yen Lee, Peng-Hsin Lee | 2018-02-27 |
| 9865531 | Power module package having patterned insulation metal substrate | Chia-Yen Lee, Peng-Hsin Lee | 2018-01-09 |
| 9847312 | Package structure | Peng-Hsin Lee | 2017-12-19 |
| 9748165 | Packaging structure | Peng-Hsin Lee | 2017-08-29 |
| 9431327 | Semiconductor device | Chia-Yen Lee, Peng-Hsin Lee | 2016-08-30 |
| 9385070 | Semiconductor component having a lateral semiconductor device and a vertical semiconductor device | Chia-Yen Lee, Peng-Hsin Lee | 2016-07-05 |
| 9275982 | Method of forming interconnection structure of package structure | Chia-Yen Lee, Peng-Hsin Lee | 2016-03-01 |
| 9209164 | Interconnection structure of package structure and method of forming the same | Chia-Yen Lee, Peng-Hsin Lee | 2015-12-08 |
| 9184111 | Wafer-level chip scale package | Chia-Yen Lee, Chi-Cheng Lin | 2015-11-10 |
| 9177957 | Embedded packaging device | Peng-Hsin Lee, Chia-Yen Lee | 2015-11-03 |
| 9159699 | Interconnection structure having a via structure | Chia-Yen Lee, Peng-Hisn Lee | 2015-10-13 |
| 8912663 | Embedded package structure and method for manufacturing thereof | Chia-Yen Lee, Peng-Hsin Lee | 2014-12-16 |