Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7999394 | Void reduction in indium thermal interface material | Seah Sun Too, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev, Raj N. Master | 2011-08-16 |
| 7651938 | Void reduction in indium thermal interface material | Seah Sun Too, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev, Raj N. Master | 2010-01-26 |
| 7482697 | Double-sided waffle pack | Soon Tatt Ow Yong, Yeow Guan Teh | 2009-01-27 |