Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327779 | Semiconductor chip including through electrode, and semiconductor package including the same | Sung Kyu Kim, Mi Seon LEE | 2025-06-10 |
| 12009308 | Semiconductor chip including through electrodes, and semiconductor package including the same | — | 2024-06-11 |
| 11823982 | Semiconductor chip including through electrode, and semiconductor package including the same | Sung Kyu Kim, Mi Seon LEE | 2023-11-21 |
| 11594471 | Semiconductor chip including through electrode, and semiconductor package including the same | Sung Kyu Kim, Mi Seon LEE | 2023-02-28 |
| 11502051 | Semiconductor chip including through electrode, and semiconductor package including the same | Sung Kyu Kim, Ju Heon YANG | 2022-11-15 |
| 10407388 | Thiourea derivatives as activators of RORα and pharmaceutical composition containing same | Mi Ock LEE, Hyeung Geun Park, Eun Jin Kim, Hyo Jun JUNG, Suck Chang Hong +1 more | 2019-09-10 |
| 10014278 | Semiconductor chip and stacked semiconductor package having the same | — | 2018-07-03 |
| 9736023 | Apparatus and method for changing status of cluster nodes, and recording medium having the program recorded therein | Jong Sam Kim, Hyun-Soo Kim, Tack Su An | 2017-08-15 |
| 9570370 | Multi chip package and method for manufacturing the same | Tac Keun OH, Jong Hoon Kim, Jeong-Hwan Lee | 2017-02-14 |
| 9159709 | Semiconductor chip and stacked semiconductor package having the same | — | 2015-10-13 |
| 9141828 | Mobile device management apparatus and method based on security policies and management server for mobile device management | Hyun Woo Jung, Jong Sam Kim, Ji Joong Gil, Jin Yong Kim | 2015-09-22 |
| 9040419 | Semiconductor package and method for manufacturing the same | — | 2015-05-26 |
| 8816477 | Semiconductor package having a contamination preventing layer formed in the semiconductor chip | — | 2014-08-26 |
| 8669642 | Semiconductor chip and fabricating method thereof | Tac Keun OH | 2014-03-11 |
| 8310045 | Semiconductor package with heat dissipation devices | — | 2012-11-13 |
| 8217434 | Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the same | Jun-Gi Choi, Seung Taek YANG | 2012-07-10 |
| 8154135 | Stacked semiconductor package | Jong Hoon Kim | 2012-04-10 |
| 7446384 | CMOS image sensor module with wafers | Kyung Wook Paik, Myung Jin Yim, Yong Min KWON | 2008-11-04 |