Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10080298 | Circuit board interconnection structure and circuit board interconnection method | Koji Motomura | 2018-09-18 |
| 10034389 | Electric component mounting method | — | 2018-07-24 |
| 9949380 | Manufacturing method of electronic component, electronic component, and manufacturing apparatus of electronic component | Wanyu TIE, Hironori Munakata | 2018-04-17 |
| 9839143 | Electrode joining method, production method of electrode joined structure | Koji Motomura, Hiroki Maruo, Tadahiko Sakai | 2017-12-05 |
| 9756728 | Component-mounted structure | Tadahiko Sakai, Koji Motomura | 2017-09-05 |
| 9015932 | Connecting method of electronic component | Tadahiko Sakai | 2015-04-28 |
| 8851138 | Substrate backing device and substrate thermocompression-bonding device | Hiroki Maruo, Koji Motomura, Tadahiko Sakai | 2014-10-07 |
| 8817487 | Electronic component mounting system and electronic component mounting method | Koji Motomura, Tadahiko Sakai | 2014-08-26 |
| 8434665 | Electronic component mounting system and electronic component mounting method | Koji Motomura, Tadahiko Sakai | 2013-05-07 |
| 8188605 | Components joining method and components joining structure | Tadahiko Sakai, Yoshiyuki Wada | 2012-05-29 |
| 8148253 | Electronic component soldering structure and electronic component soldering method | Mitsuru Ozono, Tadahiko Sakai | 2012-04-03 |
| 8034447 | Electronic components mounting adhesive and electronic components mounting structure | Tadahiko Sakai, Kouji Motomura | 2011-10-11 |
| 8025205 | Electronic component mounting method | Tadahiko Sakai, Osamu Suzuki, Satomi Kawamoto | 2011-09-27 |
| 8018074 | Components joining method and components joining structure | Tadahiko Sakai, Yoshiyuki Wada | 2011-09-13 |
| 7886432 | Electric components connecting method | Tadahiko Sakai | 2011-02-15 |
| 7845074 | Method for manufacturing electronic parts module | Koji Motomura, Tadahiko Sakai | 2010-12-07 |
| 7841081 | Method for manufacturing electronic parts module | Koji Motomura, Tadahiko Sakai | 2010-11-30 |
| 7797822 | Electronic component mounting method | Tadahiko Sakai, Teruaki Nishinaka | 2010-09-21 |
| 7793413 | Method of mounting electronic components | Tadahiko Sakai | 2010-09-14 |
| 6209196 | Method of mounting bumped electronic components | Mitsuru Ozono, Tadahiko Sakai | 2001-04-03 |
| 6179198 | Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps | Mitsuru Ozono, Tadahiko Sakai, Shoji Sakemi | 2001-01-30 |
| 6000127 | Electronic parts mounting method | Tadahiko Sakai | 1999-12-14 |
| 5962925 | Mounting structure of electronic component having bumps | Tadahiko Sakai | 1999-10-05 |
| 5749510 | Semiconductor chip bonding method | — | 1998-05-12 |