| 12272610 |
Semiconductor package with stiffener |
— |
2025-04-08 |
| 11574819 |
Semiconductor device and method for manufacturing the same |
Chanho Lee, Hyunsoo Chung, Inyoung Lee |
2023-02-07 |
| 10937771 |
Semiconductor packages |
Jichul Kim, Jae Choon Kim, KyongSoon Cho, Youngsang Cho, Yeo-Hoon Yoon |
2021-03-02 |
| 10937667 |
Semiconductor device and method for manufacturing the same |
Chanho Lee, Hyunsoo Chung, Inyoung Lee |
2021-03-02 |
| 10699915 |
Semiconductor device and method for manufacturing the same |
Chanho Lee, Hyunsoo Chung, Inyoung Lee |
2020-06-30 |
| 10347611 |
Semiconductor packages having redistribution substrate |
Jichul Kim, Jae Choon Kim, KyongSoon Cho, Youngsang Cho, Yeo-Hoon Yoon |
2019-07-09 |
| 10211070 |
Semiconductor device and method for manufacturing the same |
Chanho Lee, Hyunsoo Chung, Inyoung Lee |
2019-02-19 |
| 9978694 |
Semiconductor package and method of fabricating the same |
KyongSoon Cho, Myoungkyun Kil |
2018-05-22 |
| 9640575 |
Semiconductor package including image sensor and holder with transparent cover and adhesive stopper |
Seungkon Mok |
2017-05-02 |
| 9324748 |
Semiconductor package including an image sensor and a holder with stoppers |
Seungkon Mok |
2016-04-26 |