Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9125332 | Filp chip interconnection structure with bump on partial pad and method thereof | Rajendra D. Pendse, Youngcheol Kim, TaeKeun Lee, Gwangjin Kim | 2015-09-01 |
| 8592989 | Integrated circuit package system with bump over via | Soohan Park, Gwangjin Kim | 2013-11-26 |
| 7759137 | Flip chip interconnection structure with bump on partial pad and method thereof | Rajendra D. Pendse, Youngcheol Kim, TaeKeun Lee, Gwangjin Kim | 2010-07-20 |