Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7494924 | Method for forming reinforced interconnects on a substrate | Hei Ming Shiu, On Lok Chau, Heng Keong Yip, Thoon Khin Chang, Lan Chu Tan | 2009-02-24 |
| 7422973 | Method for forming multi-layer bumps on a substrate | Hei Ming Shiu, On Lok Chau | 2008-09-09 |
| 7279409 | Method for forming multi-layer bumps on a substrate | Hei Ming Shiu, On Lok Chau | 2007-10-09 |