Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7351641 | Structure and method of forming capped chips | Belgacem Haba, Masud Beroz, David B. Tuckerman | 2008-04-01 |
| 7268426 | High-frequency chip packages | Michael Warner, Lee Smith, Belgacem Haba, Masud Beroz, Teck-Gyu Kang | 2007-09-11 |
| 7176506 | High frequency chip packages with connecting elements | Masud Beroz, Michael Warner, Lee Smith, Teck-Gyu Kang, Jae M. Park +1 more | 2007-02-13 |
| 5439622 | Method and apparatus for producing molded parts | Robert W. Pennisi | 1995-08-08 |