| 12311577 |
Method and apparatus for simultaneously slicing a multiplicity of slices from a workpiece |
— |
2025-05-27 |
| 11878359 |
Wire saw, wire guide roll and method for simultaneously cutting a multiplicity of wafers from an ingot |
— |
2024-01-23 |
| 9573296 |
Method for simultaneously cutting a multiplicity of slices of particularly uniform thickness from a workpiece |
— |
2017-02-21 |
| 9539695 |
Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers |
Michael Kerstan, Heiko aus dem Spring |
2017-01-10 |
| 9346188 |
Apparatus and method for simultaneously slicing a multiplicity of slices from a workpiece |
— |
2016-05-24 |
| 9333673 |
Method for simultaneously cutting a multiplicity of wafers from a workpiece |
— |
2016-05-10 |
| 9199791 |
Device and method for buffer-storing a multiplicity of wafer-type workpieces |
— |
2015-12-01 |
| 9011209 |
Method and apparatus for trimming the working layers of a double-side grinding apparatus |
Michael Kerstan |
2015-04-21 |
| 8986070 |
Method for trimming the working layers of a double-side grinding apparatus |
Michael Kerstan |
2015-03-24 |
| 8974267 |
Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers |
Michael Kerstan |
2015-03-10 |
| 8911281 |
Method for trimming the working layers of a double-side grinding apparatus |
Michael Kerstan |
2014-12-16 |
| 8851958 |
Method for the simultaneous double-side material-removing processing of at least three workpieces |
— |
2014-10-07 |
| 8801500 |
Method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers |
— |
2014-08-12 |
| 8795776 |
Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatus |
— |
2014-08-05 |
| 8685270 |
Method for producing a semiconductor wafer |
Juergen Schwandner, Thomas Buschhardt, Diego Feijoo, Michael Kerstan, Guenter Schwab |
2014-04-01 |
| 8647985 |
Method for polishing a substrate composed of semiconductor material |
Juergen Schwandner, Thomas Buschhardt, Roland Koppert |
2014-02-11 |
| 8512099 |
Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers |
Michael Kerstan, Frank Runkel, Conrad von Bechtolsheim, Helge Moeller |
2013-08-20 |
| 8398878 |
Methods for producing and processing semiconductor wafers |
— |
2013-03-19 |
| 8113913 |
Method for the simultaneous grinding of a plurality of semiconductor wafers |
Michael Kerstan, Heiko aus dem Spring |
2012-02-14 |
| 7867059 |
Semiconductor wafer, apparatus and process for producing the semiconductor wafer |
Michael Kerstan, Werner Blaha |
2011-01-11 |
| 7815489 |
Method for the simultaneous double-side grinding of a plurality of semiconductor wafers |
Michael Kerstan, Heiko aus dem Spring |
2010-10-19 |
| 7077726 |
Semiconductor wafer with improved local flatness, and method for its production |
Michael Kerstan, Anton Huber |
2006-07-18 |
| 6051498 |
Method for manufacturing a semiconductor wafer which is coated on one side and provided with a finish |
Bernd Sauter, Ernst Feuchtinger |
2000-04-18 |
| 5952242 |
Method and device for removing a semiconductor wafer from a flat substrate |
Ernst Feuchtinger |
1999-09-14 |